Micro Probing Systems
- Delivering probing solutions since 1968
- Manual & Semi-Auto probe stations
- DC IV/CV parametric & shielded low noise options for (1/f) & fA leakage
- RF/Microwave stands, robust Tuner platforms, Probes, Cal Substrates and Software, cabling
- Characterization, FA, Debug, Reliability
- Thermal conditioning (-65C to 300C), New Wave laser ready
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Sample Preparation
- Mechanical package decapsulation
- RIE systems
- Acid decapping tools
- ASAP-1 Backside prep for photoemission analysis
- Cross-sectioning, die delayering, lapping, and polishing
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Vibration Control Products
- Vibration isolation tables
- Lightweight benchtop systems
- Vibration surveys
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Microscopes and Digital Cameras
- Commercial and University markets
- Simple stereo to high-end compound microscopes
- Digital cameras and couplers
- Illumination and stands
- Repair/alignment service
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Value Line of Probing Accessories
- Probe heads and probe arms
- Motorized probe heads
- Programmable probes and controller
- Custom software
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Value line of photoemission systems
- Based on Hamamatsu ORCA cameras
- Korima interface electronics and GUI
- Optional laser integration for circuit surgery
- Integrated dark box options
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Reliability Test Equipment
- Thermal chucks: -65C up to 400C (4″ to 300mm)
- HAST ovens, autoclaves (PTHB)
- Centrifuge systems up to 40,000 G force
- Gross leak and preconditioning systems
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Laser Cutters for Failure Analysis
- Compact air-cooled lasers, low maintenance
- Removal of passivation, oxide, and metal layers, cutting metal lines
- Multi-wavelength, user selectable (1064, 532, 355, 266 nm)
- Safety interlocks
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Laser Decapping Systems
- Laser removal of bulk mold compound
- Speeds up acid decap process
- Package and PCB Cross sectioning
- Micro-machining
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EMMI and Thermal Analysis
- Failure analysis/ debug/ thermal characterization
- OBIRCH, LIVA, TIVA
- InGaAs, InSb, laser, Hi-Res Nanolens
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Acoustic Inspection Systems
- Detection of voids, die cracks, delaminations, undefill in electronic packages
- Multiple scan modes for comprehensive view of area of interest
- Void/delamination detection in bonded wafers
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Burn-In Sockets
- 30 yrs designing, manufacturing high-quality sockets
- Sockets for BGA, QFN, QFP, LCC, SO, SSOP, & LGA
- Texas-based manufacturing
- H-pin high performance stamped pogo pin
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Custom Test Sockets
- Custom test sockets up to 30GHz
- Low cost test sockets with PGA adapters for I/O testers
- Test probes for continuity testing of burn-in sockets
- Breakout boards and tester interfaces
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